Issued Patents 2023
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11665834 | Electronic assembly having circuit carrier and manufacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2023-05-30 |
| 11664350 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu | 2023-05-30 |
| 11658085 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |
| 11658164 | Electronics card including multi-chip module | Chen-Hua Yu, Chien-Hsun Lee | 2023-05-23 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Chien-Hsun Lee, Chung-Shi Liu, Chen-Hua Yu | 2023-05-23 |
| 11616026 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2023-03-28 |
| 11605621 | Hybrid integrated circuit package and method | Chen-Hua Yu, Hsing-Kuo Hsia | 2023-03-14 |
| 11602056 | Circuit board and semiconductor device including the same | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2023-03-07 |
| 11594498 | Semiconductor package and method | Chen-Hua Yu, Chung-Shi Liu | 2023-02-28 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang | 2023-02-28 |