Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670575 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Chien-Hsun Chen, Jiun Yi Wu | 2023-06-06 |
SW
Shou-Yi Wang
Overall (2023): #253,032 of 537,848Top 50%
1
Patents 2023