Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11765975 | Thermocouple device | Ming-Hsien Tsai, Fu-Lung Hsueh, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2023-09-19 |
| 11713242 | MEMS device with dummy-area utilization for pressure enhancement | Chun-Wen Cheng, Fei-Lung Lai, Kuei-Sung Chang | 2023-08-01 |
| 11661333 | Semiconductor structure and manufacturing method thereof | Wei-Jhih Mao, Kuei-Sung Chang, Chun-Wen Cheng | 2023-05-30 |
| 11591211 | Semiconductive structure and manufacturing method thereof | Yen-Cheng Liu, Cheng-Yu Hsieh, Kuei-Sung Chang | 2023-02-28 |
| 11542151 | MEMS apparatus with anti-stiction layer | Kuei-Sung Chang, Fei-Lung Lai, Cheng-Yu Hsieh | 2023-01-03 |