Issued Patents All Time
Showing 101–125 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen +1 more | 2022-07-19 |
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Shou-Cheng Hu, Chih-Wei Lin, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11387143 | Redistribution lines with protection layers and method forming same | Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2022-07-12 |
| 11355471 | System for processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Chung-Shi Liu | 2022-06-07 |
| 11355378 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Hung-Jui Kuo | 2022-06-07 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue, Ching-Wen Hsiao +1 more | 2022-05-31 |
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11329008 | Method for manufacturing semiconductor package for warpage control | Chen-Shien Chen, Ming-Chih Yew, Yu-Tse Su | 2022-05-10 |
| 11322360 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Chung-Shi Liu | 2022-05-03 |
| 11289404 | Semiconductor device and method | Hsu-Lun Liu, Wen-Hsiung Lu, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2022-03-29 |
| 11282817 | Semiconductor device package including embedded conductive elements | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Kai-Chiang Wu | 2022-03-22 |
| 11264342 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2022-03-01 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Chung-Shi Liu | 2022-02-01 |
| 11177137 | Wafer etching process and methods thereof | Wen-Hsiung Lu, Hui-Min Huang, Wei-Hung Lin, Chen-En Yen, Hsu-Lun Liu | 2021-11-16 |
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Hui-Min Huang, Wei-Hung Lin, Wen-Hsiung Lu, Chang-Jung Hsueh, Kuan-Liang Lai | 2021-11-09 |
| 11158605 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin | 2021-10-26 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Yung Ching Chen | 2021-10-05 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2021-09-28 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Chung-Shi Liu | 2021-08-24 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2021-08-24 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chang-Jung Hsueh, Chin Wei Kang, Hui-Min Huang, Wei-Hung Lin +2 more | 2021-08-17 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Kuo-Ching Hsu +4 more | 2021-07-27 |