Issued Patents All Time
Showing 76–100 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817413 | Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the same | Neng-Chieh CHANG, Po-Hao Tsai, Wen-Hsiung Lu, Hsu-Lun Liu | 2023-11-14 |
| 11776945 | Package-on-package structure including a thermal isolation material | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Chung-Shi Liu | 2023-10-03 |
| 11776881 | Semiconductor device and method | Hsu-Lun Liu, Wen-Hsiung Lu, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2023-10-03 |
| 11769741 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue, Ching-Wen Hsiao +1 more | 2023-09-26 |
| 11769716 | Semiconductor device and methods of forming the same | Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Wen-Hsiung Lu, Tang-Wei Huang +1 more | 2023-09-26 |
| 11749535 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Chung-Shi Liu | 2023-09-05 |
| 11742204 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2023-08-29 |
| 11721579 | Redistribution lines with protection layers and method forming same | Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2023-08-08 |
| 11721659 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2023-08-08 |
| 11688708 | Chip structure and method for forming the same | Shan-Yu Huang, Hsiao-Wen Chung, Ching-Wen Hsiao, LI-CHUN HUNG, Yuan-Yao Chang +1 more | 2023-06-27 |
| 11664287 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2023-05-30 |
| 11640954 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2023-05-02 |
| 11594508 | Redistribution lines having nano columns and method forming same | Po-Hao Tsai, Wen-Hsiung Lu, Hsu-Lun Liu, Kai-Di Wu, Su-Fei Lin | 2023-02-28 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin, Chin Wei Kang +1 more | 2023-01-31 |
| 11545465 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo | 2023-01-03 |
| 11532692 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Mirng-Ji Lii | 2022-12-20 |
| 11532564 | Package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ching-Hua Hsieh +1 more | 2022-12-20 |
| 11532498 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Chung-Shi Liu | 2022-12-20 |
| 11527490 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu | 2022-12-13 |
| 11462509 | Package structure with electronic device in cavity substrate and method for forming the same | Po-Hao Tsai, Mirng-Ji Lii | 2022-10-04 |
| 11456266 | Bump structure and method of manufacturing bump structure | Ching-Yu Chang, Ming-Hui Weng | 2022-09-27 |
| 11450567 | Package component with stepped passivation layer | Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2022-09-20 |
| 11432372 | Warpage control in the packaging of integrated circuits | Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2022-08-30 |
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ching-Hua Hsieh | 2022-08-02 |