Issued Patents All Time
Showing 126–150 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin | 2021-07-06 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2021-06-29 |
| 11043463 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Chung-Shi Liu | 2021-06-22 |
| 11024593 | Metal bumps and method forming same | Yung-Ching Chao, Chun-Kai Tzeng, Cheng-Jen Lin, Chin Wei Kang, Yu-Feng Chen +1 more | 2021-06-01 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2021-06-01 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2021-05-11 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-04-20 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin +1 more | 2021-04-06 |
| 10964663 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu | 2021-03-30 |
| 10964641 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2021-03-30 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2021-03-16 |
| 10950572 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu | 2021-03-16 |
| 10910466 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Mirng-Ji Lii | 2021-02-02 |
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Chung-Shi Liu | 2020-12-29 |
| 10867960 | Device package including molding compound having non-planar top surface around a die and method of forming same | Chen-Hua Yu, Meng-Tse Chen, Chung-Shi Liu | 2020-12-15 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ching-Hua Hsieh +1 more | 2020-12-15 |
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo | 2020-12-08 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Wei-Yu Chen | 2020-11-17 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Kuo Lung Pan +3 more | 2020-11-17 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen +1 more | 2020-11-10 |
| 10811369 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu | 2020-10-20 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, An-Jhih Su, Shing-Chao Chen, Ching-Hua Hsieh, Chung-Shi Liu +1 more | 2020-10-06 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin +2 more | 2020-10-06 |
| 10797005 | Semiconductor package and method for manufacturing the same | Chen-Shien Chen, Ming-Chih Yew, Yu-Tse Su | 2020-10-06 |