Issued Patents All Time
Showing 101–125 of 234 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10358715 | Integrated cluster tool for selective area deposition | Tobin Kaufman-Osborn, Ludovic Godet, Qiwei Liang, Adib Khan | 2019-07-23 |
| 10347516 | Substrate transfer chamber | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Arvind Sundarrajan, Avinash Avula, Ellie Yieh | 2019-07-09 |
| 10297441 | Low-temperature atomic layer deposition of boron nitride and BN structures | Steven Wolf, Mary Edmonds, Andrew C. Kummel, Ellie Yieh | 2019-05-21 |
| 10269571 | Methods for fabricating nanowire for semiconductor applications | Keith Tatseun Wong, Shiyu Sun, Sean S. Kang, Nam Sung Kim, Ellie Yieh | 2019-04-23 |
| 10249495 | Diamond like carbon layer formed by an electron beam plasma process | Yang Yang, Lucy Chen, Jie Zhou, Kartik Ramaswamy, Kenneth S. Collins +5 more | 2019-04-02 |
| 10240232 | Gas control in process chamber | Qiwei Liang, Ellie Yieh | 2019-03-26 |
| 10233547 | Methods of etching films with reduced surface roughness | Benjamin Schmiege, Nitin K. Ingle, Jeffrey W. Anthis, Xikun Wang, Jie Liu +1 more | 2019-03-19 |
| 10224224 | High pressure wafer processing systems and related methods | Qiwei Liang, Adib Khan, Venkata Ravishankar Kasibhotla, Sultan Malik, Sean S. Kang +1 more | 2019-03-05 |
| 10203604 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Daniel J. Woodruff +2 more | 2019-02-12 |
| 10179941 | Gas delivery system for high pressure processing chamber | Adib Khan, Qiwei Liang, Sultan Malik, Keith Tatseun Wong | 2019-01-15 |
| 10153187 | Methods and apparatus for transferring a substrate | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Arvind Sundarrajan, Avinash Avula, Ellie Yieh | 2018-12-11 |
| 10128337 | Methods for forming fin structures with desired profile for 3D structure semiconductor applications | Jie Zhou, Zhong Qiang Hua, Chentsau Chris Ying, Ellie Yieh | 2018-11-13 |
| 10096512 | Gapfill film modification for advanced CMP and recess flow | Erica Chen, Ludovic Godet, Ellie Yieh | 2018-10-09 |
| 10096496 | Process chamber for etching low K and other dielectric films | Dmitry Lubomirsky, Ellie Yieh, Sergey G. Belostotskiy | 2018-10-09 |
| 10096466 | Pulsed plasma for film deposition | Jun Xue, Ludovic Godet, Michael W. Stowell, Qiwei Liang, Douglas A. Buchberger, Jr. | 2018-10-09 |
| 10095114 | Process chamber for field guided exposure and method for implementing the process chamber | Kartik Ramaswamy | 2018-10-09 |
| 10062602 | Method of etching a porous dielectric material | Nicolas Posseme, Sebastien Barnola, Olivier Joubert, Laurent Vallier | 2018-08-28 |
| 10049927 | Seam-healing method upon supra-atmospheric process in diffusion promoting ambient | Bencherki Mebarki, Sean S. Kang, Keith Tatseun Wong, He Ren, Mehul Naik +1 more | 2018-08-14 |
| 9993853 | Method and apparatus for backside cleaning of substrates | Sriskantharajah Thirunavukarasu, Jen Sern Lew, Arvind Sundarrajan | 2018-06-12 |
| 9978596 | Self-aligned multiple spacer patterning schemes for advanced nanometer technology | Ying Zhang, Uday Mitra, Praburam Gopalraja, Hua Chung | 2018-05-22 |
| 9947539 | Plasma poisoning to enable selective deposition | Ludovic Godet, Tobin Kaufman-Osborn | 2018-04-17 |
| 9911594 | Selective atomic layer deposition process utilizing patterned self assembled monolayers for 3D structure semiconductor applications | Ellie Yieh, Ludovic Godet, Yin Fan | 2018-03-06 |
| 9896770 | Methods of etching films with reduced surface roughness | Benjamin Schmiege, Nitin K. Ingle, Jeffrey W. Anthis, Xikun Wang, Jie Liu +1 more | 2018-02-20 |
| 9865466 | Silicide phase control by confinement | Bencherki Mebarki, Ellie Yieh, Mehul Naik | 2018-01-09 |
| 9865484 | Selective etch using material modification and RF pulsing | Bhargav S. Citla, Chentsau Ying, Viachslav Babayan, Michael W. Stowell | 2018-01-09 |