Issued Patents All Time
Showing 126–150 of 234 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852916 | Single platform, multiple cycle spacer deposition and etch | Hao Chen, Chentsau Ying, Ellie Yieh | 2017-12-26 |
| 9847252 | Methods for forming 2-dimensional self-aligned vias | Bencherki Mebarki, Mehul Naik | 2017-12-19 |
| 9847289 | Protective via cap for improved interconnect performance | Mehul Naik, Paul F. Ma | 2017-12-19 |
| 9829790 | Immersion field guided exposure and post-exposure bake process | Douglas A. Buchberger, Jr., Sang Ki Nam, Viachslav Babayan, Christine Y Ouyang, Ludovic Godet | 2017-11-28 |
| 9777378 | Advanced process flow for high quality FCVD films | Erica Chen, Ludovic Godet, Jun Xue, Ellie Yieh | 2017-10-03 |
| 9773675 | 3D material modification for advanced processing | Ludovic Godet, Erica Chen, Jun Xue, Ellie Yieh, Gary E. Dickerson | 2017-09-26 |
| 9754791 | Selective deposition utilizing masks and directional plasma treatment | Ludovic Godet, Yin Fan, Ellie Yieh | 2017-09-05 |
| 9748366 | Etching oxide-nitride stacks using C4F6H2 | Jong Mun Kim, Kenny L. Doan, Li Ling, Jairaj Payyapilly, Daisuke Shimizu +1 more | 2017-08-29 |
| 9748148 | Localized stress modulation for overlay and EPE | Ellie Yieh, Huixiong Dai, Ludovic Godet, Christopher Dennis Bencher | 2017-08-29 |
| 9721807 | Cyclic spacer etching process with improved profile control | Qingjun Zhou, Jungmin Ko, Tom Choi, Sean S. Kang, Jeremiah T. Pender +1 more | 2017-08-01 |
| 9716005 | Plasma poisoning to enable selective deposition | Ludovic Godet, Tobin Kaufman-Osborn | 2017-07-25 |
| 9698015 | Method for patterning a semiconductor substrate | — | 2017-07-04 |
| 9666414 | Process chamber for etching low k and other dielectric films | Dmitry Lubomirsky, Ellie Yieh, Sergey G. Belostotskiy | 2017-05-30 |
| 9640385 | Gate electrode material residual removal process | Bhargav S. Citla, Chentsau Ying | 2017-05-02 |
| 9620407 | 3D material modification for advanced processing | Ludovic Godet, Erica Chen, Jun Xue, Ellie Yieh, Gary E. Dickerson | 2017-04-11 |
| 9595467 | Air gap formation in interconnection structure by implantation process | Jun Xue, Ludovic Godet, Erica Chen, Ellie Yieh | 2017-03-14 |
| 9583339 | Method for forming spacers for a transistor gate | Nicolas Posseme, Thibaut David, Olivier Joubert, Thorsten Lill, Laurent Vallier | 2017-02-28 |
| 9548201 | Self-aligned multiple spacer patterning schemes for advanced nanometer technology | Ying Zhang, Uday Mitra, Praburam Gopalraja, Hua Chung | 2017-01-17 |
| 9540736 | Methods of etching films with reduced surface roughness | Benjamin Schmiege, Nitin K. Ingle, Jeffrey W. Anthis, Xikun Wang, Jie Liu +1 more | 2017-01-10 |
| 9543163 | Methods for forming features in a material layer utilizing a combination of a main etching and a cyclical etching process | Mang-Mang Ling, Jungmin Ko, Sean S. Kang, Jeremiah T. Pender, Bradley J. Howard | 2017-01-10 |
| 9530674 | Method and system for three-dimensional (3D) structure fill | Ellie Yieh, Ludovic Godet, Er-Xuan Ping, Gary E. Dickerson | 2016-12-27 |
| 9528185 | Plasma uniformity control by arrays of unit cell plasmas | Sang Ki Nam, Tae Seung Cho, Ludovic Godet | 2016-12-27 |
| 9514953 | Methods for barrier layer removal | Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, He Ren, Mehul Naik | 2016-12-06 |
| 9515166 | Selective atomic layer deposition process utilizing patterned self assembled monolayers for 3D structure semiconductor applications | Ellie Yieh, Ludovic Godet, Yin Fan | 2016-12-06 |
| 9508561 | Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications | Mehul Naik, Takehito Koshizawa, He Ren | 2016-11-29 |