Issued Patents 2022
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532692 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Mirng-Ji Lii | 2022-12-20 |
| 11532564 | Package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ching-Hua Hsieh +1 more | 2022-12-20 |
| 11532498 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Chung-Shi Liu | 2022-12-20 |
| 11527490 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu | 2022-12-13 |
| 11462509 | Package structure with electronic device in cavity substrate and method for forming the same | Po-Hao Tsai, Mirng-Ji Lii | 2022-10-04 |
| 11456266 | Bump structure and method of manufacturing bump structure | Ching-Yu Chang, Ming-Hui Weng | 2022-09-27 |
| 11450567 | Package component with stepped passivation layer | Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2022-09-20 |
| 11432372 | Warpage control in the packaging of integrated circuits | Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2022-08-30 |
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ching-Hua Hsieh | 2022-08-02 |
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen +1 more | 2022-07-19 |
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Shou-Cheng Hu, Chih-Wei Lin, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11387143 | Redistribution lines with protection layers and method forming same | Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2022-07-12 |
| 11355378 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Hung-Jui Kuo | 2022-06-07 |
| 11355471 | System for processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Chung-Shi Liu | 2022-06-07 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue, Ching-Wen Hsiao +1 more | 2022-05-31 |
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11329008 | Method for manufacturing semiconductor package for warpage control | Chen-Shien Chen, Ming-Chih Yew, Yu-Tse Su | 2022-05-10 |
| 11322360 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Chung-Shi Liu | 2022-05-03 |
| 11289404 | Semiconductor device and method | Hsu-Lun Liu, Wen-Hsiung Lu, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2022-03-29 |
| 11282817 | Semiconductor device package including embedded conductive elements | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Kai-Chiang Wu | 2022-03-22 |
| 11264342 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2022-03-01 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Chung-Shi Liu | 2022-02-01 |