Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527457 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2022-12-13 |
| 11393746 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2022-07-19 |
| 11329006 | Semiconductor device package with warpage control structure | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2022-05-10 |
| 11329008 | Method for manufacturing semiconductor package for warpage control | Chen-Shien Chen, Ming-Da Cheng, Yu-Tse Su | 2022-05-10 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Chin-Hua Wang, Chia-Kuei Hsu, Po-Chen Lai, Po-Yao Lin +1 more | 2022-03-22 |
| 11282803 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2022-03-22 |
| 11270953 | Structure and formation method of chip package with shielding structure | Po-Yao Chuang, Po-Hao Tsai, Shin-Puu Jeng, Shuo-Mao Chen | 2022-03-08 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2022-03-01 |