Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Shin-Puu Jeng | 2022-12-20 |
| 11450622 | Semiconductor package | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2022-09-20 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Ming-Chih Yew, Chia-Kuei Hsu, Po-Chen Lai, Po-Yao Lin +1 more | 2022-03-22 |
| 11264300 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen | 2022-03-01 |