Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410939 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2022-08-09 |
| 11328971 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2022-05-10 |
| 11251114 | Package substrate insulation opening design | Shu-Jung Tseng | 2022-02-15 |