Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2022-12-20 |
| 11532593 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Chen Lai, Shu-Shen Yeh | 2022-12-20 |
| 11527457 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Shin-Puu Jeng | 2022-12-13 |
| 11508710 | Method of forming semiconductor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2022-11-22 |
| 11488898 | Bump joint structure with distortion and method forming same | Shin-Puu Jeng | 2022-11-01 |
| 11456257 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu | 2022-09-27 |
| 11450622 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2022-09-20 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |
| 11393746 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2022-07-19 |
| 11329006 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Fu-Jen Li, Kuo-Chuan Liu | 2022-05-10 |
| 11328971 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2022-05-10 |
| 11282803 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Shin-Puu Jeng | 2022-03-22 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Chen Lai +1 more | 2022-03-22 |
| 11264300 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang | 2022-03-01 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Shin-Puu Jeng | 2022-03-01 |