Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2022-12-20 |
| 11527457 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2022-12-13 |
| 11495155 | Pixel circuit | Chih-Lung Lin, Chin-Hsien Tseng, Po-Cheng Lai, Mao-Hsun Cheng | 2022-11-08 |
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Wen-Chih Chiou, Shin-Puu Jeng | 2022-11-01 |
| 11450622 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2022-09-20 |
| 11313058 | Flat knitting machine structure with adjustable gap between two knock-over bits | Chih-Chiang Lee | 2022-04-26 |
| 11280015 | Non-enzyme sensor, non-enzyme sensor element and fabricating method thereof | Hsiang-Yu Wang, Yi-Yu Chen, Shih-Hao Lin | 2022-03-22 |