Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Tsung-Shang Wei, Yu-Sheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2022-11-01 |
| D940488 | Foot ring for a chair | — | 2022-01-11 |