Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Yu-Sheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2022-11-01 |