Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527439 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu, Chen-Hua Yu | 2022-12-13 |
| 11502072 | Integrated circuit package and method | Chen-Hua Yu, Yung-Chi Lin | 2022-11-15 |
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Yu-Sheng Lin, Shin-Puu Jeng | 2022-11-01 |
| 11487060 | Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Chen-Hua Yu | 2022-11-01 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11469197 | Integrated circuit package and method | Chen-Hua Yu, Shih-Ting Lin, Szu-Wei Lu | 2022-10-11 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11437344 | Wafer bonding method | Yung-Chi Lin, Tsang-Jiuh Wu, Chen-Hua Yu | 2022-09-06 |
| 11355475 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Tsang-Jiuh Wu | 2022-06-07 |
| 11304290 | Semiconductor structures and methods | Chen-Hua Yu, Yung-Chi Lin | 2022-04-12 |
| 11289450 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh | 2022-03-29 |
| 11264262 | Wafer debonding and cleaning apparatus | Yu-Liang Lin, Hung-Jung Tu | 2022-03-01 |
| 11239201 | 3D integrated circuit (3DIC) structure | Chen-Hua Yu, Chung-Shi Liu | 2022-02-01 |