Issued Patents 2022
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527419 | Photonic integrated package and method forming same | Chen-Hua Yu, Wei-Yu Chen | 2022-12-13 |
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2022-11-15 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, Szu-Wei Lu +2 more | 2022-10-25 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11469215 | Chip package structure with molding layer and method for forming the same | Wei-Yu Chen | 2022-10-11 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-10-11 |
| 11462531 | Multi-stack package-on-package structures | Chen-Hua Yu | 2022-10-04 |
| 11462530 | Multi-stack package-on-package structures | Chen-Hua Yu | 2022-10-04 |
| 11450612 | Semiconductor devices and methods of manufacturing the same | Yu-Hung Lin, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2022-09-20 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2022-09-13 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11444021 | Device and package structure and method of forming the same | Hsien-Wei Chen, Li-Hsien Huang | 2022-09-13 |
| 11410956 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2022-08-09 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11342196 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2022-05-24 |
| 11276656 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, Tsung-Shu Lin | 2022-03-15 |
| 11264363 | Chip package structure with seal ring structure | Chen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai | 2022-03-01 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2022-01-04 |