Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2022-11-15 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2022-10-25 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-10-11 |
| 11450612 | Semiconductor devices and methods of manufacturing the same | Yu-Hung Lin, An-Jhih Su, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan | 2022-09-20 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2022-09-13 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2022-09-13 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2022-01-04 |