Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2022-11-15 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11444021 | Device and package structure and method of forming the same | Hsien-Wei Chen, An-Jhih Su | 2022-09-13 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2022-09-13 |
| 11430670 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2022-08-30 |
| 11410956 | Chip package structure with bump | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2022-08-09 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Po-Hao Tsai +2 more | 2022-01-04 |