Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527502 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2022-12-13 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2022-11-29 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11302600 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2022-04-12 |
| 11289398 | Package structure and manufacturing method thereof | Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Yi-Chung Huang | 2022-03-29 |
| 11282825 | Package structure | Tsung-Yu Chen, Wensen Hung | 2022-03-22 |
| 11276656 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, An-Jhih Su | 2022-03-15 |