Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302600 | Semiconductor device and manufacturing method thereof | Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2022-04-12 |
| 11282766 | Package structure | Shih-Chang Ku, Hung-Chi Li | 2022-03-22 |
| 11282825 | Package structure | Tsung-Shu Lin, Tsung-Yu Chen | 2022-03-22 |
| 11257690 | 3DIC package comprising perforated foil sheet | — | 2022-02-22 |