Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289398 | Package structure and manufacturing method thereof | Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin | 2022-03-29 |
YH
Yi-Chung Huang
Overall (2022): #201,038 of 548,613Top 40%
1
Patents 2022