Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289398 | Package structure and manufacturing method thereof | Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2022-03-29 |
SW
Shih-Hui Wang
Overall (2022): #258,044 of 548,613Top 50%
1
Patents 2022