Issued Patents 2022
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532567 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2022-12-20 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Cheng-Hsien Hsieh, Li-Han Hsu +3 more | 2022-11-29 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11502032 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2022-11-15 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2022-10-25 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Wei Chen, Li-Han Hsu +1 more | 2022-10-11 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11450612 | Semiconductor devices and methods of manufacturing the same | Yu-Hung Lin, An-Jhih Su, Shih-Guo Shen, Chia-Nan Yuan, Ming-Shih Yeh | 2022-09-20 |
| 11444034 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2022-09-13 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2022-09-13 |
| 11444057 | Package structures and methods of forming | Chen-Hua Yu, Hsien-Wei Chen | 2022-09-13 |
| 11430670 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2022-08-30 |
| 11424189 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen | 2022-08-23 |
| 11373969 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Hsien-Wei Chen, Jie Chen | 2022-06-28 |
| 11355468 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11342196 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2022-05-24 |
| 11335658 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Jui-Pin Hung | 2022-05-17 |
| 11289398 | Package structure and manufacturing method thereof | Shih-Hui Wang, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang | 2022-03-29 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2022-02-15 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Li-Hsien Huang, Po-Hao Tsai +2 more | 2022-01-04 |