Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532569 | Method for manufacturing semiconductor package structure | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, De-Dui Liao | 2022-12-20 |
| 11362046 | Semiconductor package | Jing-Cheng Lin, Chin-Chuan Chang | 2022-06-14 |
| 11335658 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Der-Chyang Yeh | 2022-05-17 |
| 11329031 | Structure and formation method for chip package | Cheng-Lin Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2022-05-10 |
| 11291116 | Integrated circuit structure | Chen-Hua Yu, Kuo-Chung Yee | 2022-03-29 |
| 11251054 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2022-02-15 |