Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538788 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-27 |
| 11532594 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-20 |
| 11532529 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-20 |
| 11482788 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Chen-Hua Yu | 2022-10-25 |
| 11462495 | Chiplets 3D SoIC system integration and fabrication methods | Chen-Hua Yu | 2022-10-04 |
| 11393805 | 3D semiconductor packages | Chen-Hua Yu, Chun-Hui Yu, Liang-Ju Yen | 2022-07-19 |
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2022-07-05 |
| 11355418 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung | 2022-06-07 |
| 11342309 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Chih-Hang Tung | 2022-05-24 |
| 11328975 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2022-05-10 |
| 11328972 | Temporary bonding scheme | Wan-Yu Lee, Ying-Hao Kuo | 2022-05-10 |
| 11289424 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Szu-Wei Lu, Ying-Ching Shih | 2022-03-29 |
| 11291116 | Integrated circuit structure | Chen-Hua Yu, Jui-Pin Hung | 2022-03-29 |