Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393805 | 3D semiconductor packages | Chen-Hua Yu, Kuo-Chung Yee, Liang-Ju Yen | 2022-07-19 |
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2022-07-05 |
| 11355418 | Package structure and manufacturing method thereof | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2022-06-07 |
| 11328975 | Semiconductor device | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2022-05-10 |