Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2022-07-05 |
| 11355418 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee | 2022-06-07 |
| 11328975 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Po-Fan Lin | 2022-05-10 |