Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515233 | Semiconductor component with cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chen-Hua Yu, Yi-Li Hsiao | 2022-11-29 |
| 11456256 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2022-09-27 |
| 11443981 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2022-09-13 |
| 11410910 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Sheng-Tsung Hsiao, Jen-Yu Wang, Chung-Jung Wu, Tung-Liang Shao | 2022-08-09 |
| 11387164 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2022-07-12 |
| 11348889 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2022-05-31 |
| 11342309 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2022-05-24 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang +2 more | 2022-05-24 |
| 11315900 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Tung-Liang Shao | 2022-04-26 |
| 11295979 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chen-Hua Yu | 2022-04-05 |