Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348889 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung | 2022-05-31 |
CW
Cheng-Chang Wei
Overall (2022): #492,834 of 548,613Top 90%
1
Patents 2022