Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515233 | Semiconductor component with cooling structure | Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu | 2022-11-29 |
| 11443981 | Bonding method of package components and bonding apparatus | Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang | 2022-09-13 |
| 11348889 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2022-05-31 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh +2 more | 2022-05-24 |