Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang +2 more | 2022-05-24 |
| 11217555 | Aligning bumps in fan-out packaging process | Chien Ling Hwang, Chih-Wei Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu | 2022-01-04 |