Issued Patents 2022
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532564 | Package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2022-12-20 |
| 11532498 | Package-on-package structure | Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-12-20 |
| 11502604 | Bang-bang flying capacitor voltage balance for buck converter | Chun-Yen Tseng, Hao-Ping Hong | 2022-11-15 |
| 11502050 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chun-Chih Lin | 2022-11-15 |
| 11484534 | Methods for treating HCV | Walid M. Awni, Barry M. Bernstein, Andrew L. Campbell, Sandeep Dutta, Wei Liu +4 more | 2022-11-01 |
| 11456226 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu | 2022-09-27 |
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2022-09-20 |
| 11441943 | Proximity sensing device | Chen-Hua Hsi | 2022-09-13 |
| 11432381 | Photosensor device | Sheng-Cheng Lee, Wen-Sheng Lin, Chen-Hua Hsi | 2022-08-30 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-08-23 |
| 11415459 | Photosensor device with dark current cancellation | Chen-Hua Hsi | 2022-08-16 |
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2022-08-02 |
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Shou-Cheng Hu, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11362089 | Gate structure with additional oxide layer and method for manufacturing the same | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2022-06-14 |
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11335717 | Semiconductor device including light-collimating layer | Chung-Ren Lao, Chih-Cherng Liao, Shih-Hao Liu, Wu-Hsi Lu, Ming-Cheng Lo +1 more | 2022-05-17 |
| 11324899 | Nebulizer | Chih-Chieh Chen, Sheng-Hsiu Huang, Yu-Mei Kuo, Wei-Ren Ke | 2022-05-10 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-05-03 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2022-02-15 |
| 11239082 | Method for fabricating semiconductor device | I-Fan Chang, Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, Jie-Ning Yang +4 more | 2022-02-01 |
| 11239103 | Package-on-package structure | Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-02-01 |
| 11233039 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Yu-Hao Chen | 2022-01-25 |
| 11217708 | Optical sensor and method for forming the same | Shih-Hao Liu, Chung-Ren Lao, Chih-Cherng Liao, Wu-Hsi Lu, Ming-Cheng Lo +1 more | 2022-01-04 |
| 11217555 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu | 2022-01-04 |