Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538897 | Display device | Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh | 2022-12-27 |
| 11532498 | Package-on-package structure | Chih-Wei Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-12-20 |
| 11387171 | Method of packaging a semiconductor die | Shou-Cheng Hu, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11347113 | Electronic device | Shu-Han Yang, Chia-Min Yeh | 2022-05-31 |
| 11289044 | Display device | Chia-Min Yeh, Hsieh-Li Chou, Cheng-Tso Chen, Yu-Chien Kao, Li-Wei Sung | 2022-03-29 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-02-01 |