Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11309255 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Ian Kent, Ernesto Gutierrez, III, Melvin Martin, Rajesh Subraya Aiyandra | 2022-04-19 |
| 11251132 | Integrated type MIS substrate for thin double side SIP package | Chehan Jerry Li, Jesus Mennen Belonio, Jr. | 2022-02-15 |
| 11239185 | Embedded resistor-capacitor film for fan out wafer level packaging | Ernesto Gutierrez, III, Jesus Mennen Belonio, Jr. | 2022-02-01 |
| 11217562 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2022-01-04 |