Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532489 | Pillared cavity down MIS-SiP | Ernesto Gutierrez, III, Eric Hu, Melvin Martin, Jerry Li, Francisco Vergara Cadacio | 2022-12-20 |
| 11309255 | Very thin embedded trace substrate-system in package (SIP) | Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III, Melvin Martin, Rajesh Subraya Aiyandra | 2022-04-19 |
| 11251132 | Integrated type MIS substrate for thin double side SIP package | Chehan Jerry Li, Shou-Cheng Hu | 2022-02-15 |
| 11239185 | Embedded resistor-capacitor film for fan out wafer level packaging | Ernesto Gutierrez, III, Shou-Cheng Hu | 2022-02-01 |