Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309255 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ernesto Gutierrez, III, Melvin Martin, Rajesh Subraya Aiyandra | 2022-04-19 |