Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495567 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Habeeb Mohiuddin Mohammed | 2022-11-08 |
| 11309255 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III, Melvin Martin | 2022-04-19 |