Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495567 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2022-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495567 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2022-11-08 |