Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476125 | Multi-die package with bridge layer | Yu-Feng Chen, Chen-Shien Chen, Mirng-Ji Lii | 2022-10-18 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Hong-Seng Shue, Ching-Wen Hsiao +1 more | 2022-05-31 |
| 11217562 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2022-01-04 |