Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue, Ching-Wen Hsiao +1 more | 2022-05-31 |