Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488878 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2022-11-01 |
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11393771 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-07-19 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue +1 more | 2022-05-31 |
| 11342253 | Package structures and methods for forming the same | Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11244919 | Package structure and method of fabricating the same | Chen-Shien Chen, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-02-08 |
| 11217562 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2022-01-04 |