Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2022-03-22 |