Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Ching-Wen Hsiao, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11393771 | Bonding structures in semiconductor packaged device and method of forming same | Ching-Wen Hsiao, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-07-19 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2022-02-08 |