Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342291 | Semiconductor packages with crack preventing structure | Hong-Seng Shue, Chen-Nan Chiu, Li-Huan Chu, Mirng-Ji Lii | 2022-05-24 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu | 2022-04-26 |
| 11258461 | Data processing device and method | Hsin-Yun Hu, Ching-Yen Lee, Ming-Jhe Du | 2022-02-22 |
| 11244940 | Stress reduction apparatus and method | Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2022-02-08 |