Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2022-11-29 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2022-02-08 |