Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +3 more | 2022-11-29 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2022-10-11 |