Issued Patents 2022
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532524 | Integrated circuit test method and structure thereof | Hsien-Wen Liu | 2022-12-20 |
| 11532567 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2022-12-20 |
| 11532598 | Package structure with protective structure and method of fabricating the same | Ching-Jung Yang, Ming-Fa Chen | 2022-12-20 |
| 11527417 | Packaged semiconductor devices and methods of packaging semiconductor devices | — | 2022-12-13 |
| 11527465 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2022-12-13 |
| 11527490 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2022-12-13 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11495559 | Integrated circuits | Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-11-08 |
| 11482499 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen | 2022-10-25 |
| 11482649 | Semiconductor package and manufacturing method of semiconductor package | Ming-Fa Chen, Jie Chen | 2022-10-25 |
| 11476201 | Package-on-package device | Ming-Fa Chen, Sung-Feng Yeh | 2022-10-18 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2022-10-11 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11462458 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2022-10-04 |
| 11456240 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2022-09-27 |
| 11450579 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Ming-Fa Chen | 2022-09-20 |
| 11444057 | Package structures and methods of forming | Chen-Hua Yu, Der-Chyang Yeh | 2022-09-13 |
| 11443995 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2022-09-13 |
| 11444021 | Device and package structure and method of forming the same | An-Jhih Su, Li-Hsien Huang | 2022-09-13 |
| 11430670 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2022-08-30 |
| 11424205 | Semiconductor interconnect structure and method | Jie Chen | 2022-08-23 |
| 11424191 | Semiconductor devices and methods of manufacture | Ming-Fa Chen | 2022-08-23 |
| 11424189 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh | 2022-08-23 |
| 11417587 | Package structure and method of fabricating the same | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-08-16 |
| 11417599 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2022-08-16 |