Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532598 | Package structure with protective structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2022-12-20 |
| 11469200 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang | 2022-10-11 |
| 11417599 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2022-08-16 |
| 11373953 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-28 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-06-14 |
| 11335610 | Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same | Hsien-Wei Chen, Jie Chen | 2022-05-17 |
| 11329022 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Yen-Ping Wang | 2022-05-10 |
| 11251100 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure | Sheng-An Kuo, Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2022-02-15 |
| 11251157 | Die stack structure with hybrid bonding structure and method of fabricating the same and package | Hsien-Wei Chen | 2022-02-15 |